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The present invention relates to a supporting substrate for supporting thereon a printed wiring board and the like and, more particularly, to a supporting substrate which is suitable for mounting a high-density large-scale chip on a printed wiring board.
The following description explains a prior art supporting substrate for supporting thereon a printed wiring board (hereinafter referred to as a PWB) in a hard-to-mount state as follows.
In the prior art supporting substrate of the above-mentioned type, a plurality of apertures are formed at a peripheral edge of a PWB on the backside of the PWB, and protruding supports, such as legs or the like, are formed on the backside of the PWB around the apertures by plating. On the other hand, the apertures have an equal depth which is determined by the thickness of a thin metal plate, such as Cu, which is the base material of the PWB. The supports are so formed as to be disposed in the apertures and to be buried in the apertures.
In a typical supporting substrate, a plurality of the supports, which are substantially rectangular, are formed in pairs and which are aligned with each other. In other words, the supports are arranged in a form of parallel straight lines. The shape of the supporting substrate is configured by arranging the supports in a matrix.
The mounting operation of the supports and the PWB is performed as follows. In the mounting operation, the PWB, for example, is positioned with respect to the supports. Thereafter, the supports are pushed in, as viewed in the thickness direction of the PWB, thereby making a pair of supports disposed on one side of the PWB to abut with a pair of supports disposed on the other side of the PWB, that is, the PWB is adhered and fixed between the supports.
In the mounting operation, the apertures formed in the PWB are larger than the thickness of the PW 0b46394aab